Researchers at The Hong Kong University of Science and Technology (HKUST) have developed a multi-source co-evaporation recipe ...
With improved process control and wider material options, SHD is accelerating development cycles and supporting more ambitious composite designs.
The powder coatings market, valued at $17.37B in 2024, will reach $28.70B by 2033, growing at 5.74% CAGR during ...
Designed for demanding semiconductor applications, the UltiDry combines robust performance with high energy efficiency ...
SHENZHEN, GUANGDONG, CHINA, January 26, 2026 /EINPresswire.com/ -- With gold and silver prices remaining elevated and ...
Evaluating the role of ALD coatings in strengthening thermal resilience and longevity in solar long metal tubes.
SHENBEI NEW DISTRICT,SHENYANG, LIAONING, CHINA, January 21, 2026 /EINPresswire.com/ -- In the rapidly evolving field of ...
Abstract: Wafer level packaging is one of the latest trends in microelectronic packaging. Wafer warpage and metal peeling are common problem in wafer level packaging. Large warpage and large area ...
Abstract: In this paper, we present our investigations on sequential plating for a low-cost bumping process. Following the demonstration of this process for low Ag concentration (1.4 wt%), we aimed ...
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