However, as ASIC and SoC clock receivers become increasingly customized, these fixed-amplitude standards no longer provide an optimal balance between power consumption, noise performance, and signal ...

The specification is backward compatible with UniPro v2.0.

India was mainly restricted to a select group of enthusiasts and early adopters. The situation is evolving as more investors, ...

Seoul, South Korea – SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has secured a design win from Niobium, a U.S.-based leader in Fully ...

Taalas HC1 with Llama 3.1 8B AI model can deliver near-instantaneous responses, even for detailed queries like a ...

YorChip announces two key initiatives as part of a comprehensive effort to jumpstart Chiplet adoption for the Physical ...

However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...

Samsung Electronics Co., Ltd., a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

In the modern AI datacenter – really, a data galaxy at this point because AI processing needs have broken well beyond the bounds of a single datacenter or ...

Abstract: Electrical Impedance Tomography (EIT) demands compact, low-power measurement systems. We present a versatile bioimpedance measurement ASIC in $\mathbf{1 8 0 ~ n m}$ CMOS for EIT. The ...

Abstract: This paper presents the design and optimization of a low-power 8-bit Arithmetic Logic Unit (ALU) developed in two phases: initial prototyping and verification on an FPGA platform using ...