Abstract: In this letter, the redistribution layer-first embedded fan-out wafer-level packaging (RDL-first FO-WLP) for 2-D ultrasonic transducer arrays with individual electrical connection is ...
Abstract: With the evolution of 5G, 6G and beyond, device-to-device (D2D) communications have been developed as an energy-, and spectrum-efficient solution. However, D2D links are allowed to share the ...
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