The specification is backward compatible with UniPro v2.0.

However, as ASIC and SoC clock receivers become increasingly customized, these fixed-amplitude standards no longer provide an optimal balance between power consumption, noise performance, and signal ...

Includes acquisition of 6,840 Avalon (R) A15Pro mining rigs ...

India was mainly restricted to a select group of enthusiasts and early adopters. The situation is evolving as more investors, ...

Seoul, South Korea – SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has secured a design win from Niobium, a U.S.-based leader in Fully ...

Taalas HC1 with Llama 3.1 8B AI model can deliver near-instantaneous responses, even for detailed queries like a ...

YorChip announces two key initiatives as part of a comprehensive effort to jumpstart Chiplet adoption for the Physical ...

However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...

Samsung Electronics Co., Ltd., a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

In the modern AI datacenter – really, a data galaxy at this point because AI processing needs have broken well beyond the ...

Abstract: Electrical Impedance Tomography (EIT) demands compact, low-power measurement systems. We present a versatile bioimpedance measurement ASIC in $\mathbf{1 8 0 ~ n m}$ CMOS for EIT. The ...