The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...

Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design ...

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and ...

SimuTech Group, part of the Synopsys portfolio, was named 2025 Worldwide Channel Partner of the Year, underscoring its role within the company’s partner network. Synopsys (NasdaqGS:SNPS) is expanding ...

According to a new report, the iPhone 18 Pro Max, and possibly the iPhone 18 as well, will be thicker to accommodate a bigger ...

This video examines what happens when familiar toys are rebuilt without meaningful budget constraints. Each product is tested ...

This hands-on overview explores the Google Pixel 10 and Pixel 10 Pro with a focus on software integration and hardware ...

It’s time for software CEOs to adopt new postures, new strategies and new market realities. Wall Street doesn’t believe your ...

As scaled-down circuits with limited functions redefine computing for AI, their flexibility requires a new approach to ...

Tech founders are dreaming of a future where we use several interconnected wearable devices at the same time. But that dream ...

CANGZHOU CITY, HEBEI PROVINCE, CHINA, February 4, 2026 /EINPresswire.com/ -- Over the past decade, manufacturing ...