The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...

Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design ...

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with ...

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and ...

SimuTech Group, part of the Synopsys portfolio, was named 2025 Worldwide Channel Partner of the Year, underscoring its role within the company’s partner network. Synopsys (NasdaqGS:SNPS) is expanding ...

With the ROG Azoth, Asus delivers a sophisticated premium keyboard with excellent typing feel, OLED display and ...

Built on the Proven Foundation of NBS U.K., Lattira Brings a Connected Construction Specification Platform to Architects and Manufacturers CHICAGO, ILLINOIS / ACCESS Newswire / February 24, 2026 / Hub ...

LOS ANGELES, CALIFORNIA / ACCESS Newswire / February 24, 2026 / Elevate today announced the release of ELM Agent (ELMA), its agentic AI for legal work. Previewed at CLOC Global Institute 2025, ELMA ex ...

This hands-on overview explores the Google Pixel 10 and Pixel 10 Pro with a focus on software integration and hardware ...

According to a new report, the iPhone 18 Pro Max, and possibly the iPhone 18 as well, will be thicker to accommodate a bigger ...

As scaled-down circuits with limited functions redefine computing for AI, their flexibility requires a new approach to ...