COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all ...

COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...

Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...

Abstract: Copper wire has found extensive applications in microelectronics packaging industry due to its low material cost, advanced electrical, mechanical and thermal properties compared to gold wire ...

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