TOKYO — Fujitsu Ltd. today (March 13) disclosed plans to accelerate expansion of its wafer-bumping and flip-chip packaging capacity for high-end ASICs, digital signal processors, programmable logic, ...
MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FBGA) technology to Advanced Interconnect Technologies of Pleasanton, Calif., which ...
"Moving to a flip-chip BGA package allows for better removal of heat (the active logic is closer to the heatsink), as well as enabling more IO pins/balls on the package itself," he said. However, Lal ...
A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...
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