The ongoing global shortage of glass fiber, a critical upstream material for PCBs, has escalated competition among major end customers and is driving a structural reallocation of capacity toward ...

Fig 1. The system-in-package approach is part of the trend toward thinner and more integrated 3D IC packages for CPUs, GPUs, and FPGAs for use in camera modules and wireless products, where high ...

While providing high volume opportunites for suppliers of the right components, consumer electronics and especially the portable consumer electronics portion places high demand on suppliers, requiring ...

Inefficiencies for OEMs to use PDF-only datasheet documentation of integrated circuits. Standards that address electronic documentation for I 2 C, SPMI, SPI, and JTAG devices. ROI: Faster volume sales ...