Silicides — alloys of silicon and metals long used in microelectronics — are now being explored again for quantum hardware. But their use faces a critical challenge: achieving phase purity, since some ...

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...

Silicides could advance quantum hardware, but phase purity is difficult; a new study finds hafnium oxide substrates help stabilize the superconducting phase. (Nanowerk News) Silicides — alloys of ...

"Achieving phase-pure superconducting films requires careful attention to the substrate-film interface," said Shahrjerdi. "Our findings show that substrate design is an integral aspect of the ...