The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

Scientists discover ultra-weak faults near the 7.2 magnitude earthquake in Haiti that continued to slip for weeks.

Thin films form the basis of many industries today, including semiconductors, electric vehicles, smart optical coatings, sophisticated medical equipment, and protective layers on high-temperature ...

The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The cause of failure in engineering structures is routinely investigated via the detailed study of material fracture surfaces. This remains a key research area in material sciences, with researchers ...